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Advanced Electronic Packages

Advanced Electronic Packages

We have a series of lightweight, hermetic, high efficiency and low thermal resistance packages to satisfy the ever changing needs of the microelectronics industry.

Features:
▪    Offers low profile, multilayer, co-fired, co-planar feedthrus, in conjunction with a highly efficient thermal management base.
▪    Design for either high frequency impedance match, DC circuits or a combination of both.
▪    Resistance or laser weldable and compatible with existing sealing systems.
▪    Base materials can be designed to match substrate TCE, reducing induced thermal stress over a wide range of operating temperatures.


Application Include:
▪    Navigation equipment (GPS)
▪    Weapons Systems
▪    Military Satellites and Aircraft
▪    Radar Systems
▪    Test and Measurement Equipment (RF Frequency)
▪    Engine Controllers
▪    Medical Equipment
▪    Communications

Typical Material Combinations
Material    Base Conductivity W/m ~K    CTE X 10-6/~C    Density LBS/in 3    Ring Frame Material
ASTM F-15 Alloy    14    4.9    .302    ASTM F-15 Alloy
W/Cu    175 - 205    6.5 - 8.3    .535 - .611    Fe Ni Alloy
Mo/Cu    165 - 185    6.5 - 7.7    .357 - .361    Fe Ni Alloy
Al/SiC    160    6.5 - 8.5    .107 - .110    Contact the factory
Al 2 O 3    25    6.9    .143    Contact the factory
GaAs    44    6.5    .193    Contact the factory
AIN    170    4.6    .120    Contact the factory

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