Advanced Opto-electronic Packages 1

Advanced Opto-electronic Packages 1

▪    Flatpack
▪    Plug-Ins Metal Package

We have an extensive range of Hermetic Opto-electronic packages.

High reliability, hermeticall sealed product in many configurations including standards——Flatpacks(butterfly style), Plug-ins(bathtub style), and plat-forms(dual-in-line style), and many other sophisticated metal composite packages. These packages are developed to hermetically encapsulate laser diode transmitter and receiver assemblies and other Opto-electronic circuits.

Products can be manufactured with matched glass-to metal seals or stripline ceramic inserts, utilizing materials ranging from ASTM F-15 to advanced thermal management materials to enhance and optimize device performance.

High quality products are made in conformance with and certified being compliant to MIL-PRF-38534.

Typical Opto Material Combinations
Base Material    Base Conductivity W/m ~K    CTE X 10-6/~C    Density LBS/in 3    Ring Frame Material
ASTM F-15    14    4.9    .302    ASTM F-15
W/Cu    175 - 205    6.5 - 8.3    .535 - .611    Fe Ni Alloy
Mo/Cu    165 - 185    6.5 - 7.7    .357 - .361    Fe Ni Alloy
Mo    140    6.0    .408    ASTM F-15
Al/SiC    160    6.5 - 8.5    .107 - .110    Contact the factory

Huona has a depth of product range, from commercial and mil spec connectors and headers to microelectronic hermetic packages, TO’s and battery seals, tantalum capacitors seals, and end seals.

we have the technology focus on doing what we do best: glass to metal and ceramic to metal sealing.

Manufactured bodies we using are standard materials – Cold Rolled Steel, Stainless Steel, Kovar…and exotic…Inconel, Monel, Molybdenum, and Titanium
Electrodes in 52 Alloy, Kovar, Stainless Steel, and Inconel; also Chromel/Alumel and Iron/Constantin for thermocouple applications

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